GELID GP-Ultimate 15W/mK Thermal Pad – CPU, GPU & PCB

GELID GP-Ultimate Thermal Pad – 15 W/mK High-Performance Heat Dissipation

Take your PC's thermal management to the next level with the GELID GP-Ultimate Thermal Pad. Engineered for builders and enthusiasts who demand class-leading heat transfer, this silicone thermal pad delivers a best-in-class 15 W/mK thermal conductivity, bridging gaps between heatsinks and components with uneven or height-varied surfaces for maximum efficiency.

Why Choose the GELID GP-Ultimate?

• Superior 15 W/mK Conductivity: Industry-leading thermal performance ensures rapid, efficient heat transfer from your CPU, GPU, MOSFETs, chipsets, analog ICs, and micro-controller units to your heatsink.
• Enhanced Multilayer Matrix: The advanced material composition fills surface gaps and irregularities on PCBs, delivering consistent, gap-free thermal contact across large and uneven surfaces.
• Non-Electrical Conductive: Totally safe around sensitive electronics — no risk of short circuits even on densely packed PCBs.
• Non-Corrosive, Non-Curing & Non-Toxic: Long-lasting performance without degradation, hardening, or chemical hazard. Safe to handle during installation.
• Wide Operating Temperature Range: Rated for extended use from -60°C to 220°C, making it suitable for high-demand overclocking setups and demanding workstation environments.
• Easy Application: Flexible silicone pad cuts and conforms easily. No mess, no special tools needed.
• Versatile 90×50mm Dimensions: Sized to cover large PCB surfaces including GPU cards, motherboards, add-on cards, and other densely packed electronic devices.

Available Thickness Variants

Single Pack (1pc):

• 0.5 mm (TP-GP04-A)
• 1.0 mm (TP-GP04-B)
• 1.5 mm (TP-GP04-C)
• 2.0 mm (TP-GP04-D)
• 3.0 mm (TP-GP04-E)

Value Pack (2pcs):

• 0.5 mm (TP-VP04-A)
• 1.0 mm (TP-VP04-B)
• 1.5 mm (TP-VP04-C)
• 2.0 mm (TP-VP04-D)
• 3.0 mm (TP-VP04-E)

Key Specifications

What's in the Box?

• 1× GELID GP-Ultimate Thermal Pad (size/thickness per selection)

Compatible With

GPU graphics cards, CPUs, motherboard chipsets, power MOSFETs, analog ICs, micro-controller units (MCUs), add-on cards, and any SMD components requiring reliable thermal interface material.

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Frequently Asked Questions

Q: What is the GELID GP-Ultimate thermal pad used for?

A: The GELID GP-Ultimate thermal pad is a high-performance silicone thermal interface material designed to fill the gap between heatsinks and components such as CPU processors, GPU graphics cards, motherboard chipsets, MOSFETs, and other PCB-mounted components. Its 15 W/mK thermal conductivity maximizes heat transfer and helps keep your system running at optimal temperatures.

Q: Is the GELID GP-Ultimate thermal pad safe to use around electronic components?

A: Yes. The GP-Ultimate is non-electrical conductive, meaning it will not cause short circuits on your PCB. It is also non-corrosive, non-curing, and non-toxic, making it completely safe for use around sensitive electronic components during installation and long-term operation.

Q: Which thickness should I choose for my GPU or motherboard?

A: The correct thickness depends on the gap between your component and heatsink. Common choices are 1.0 mm or 1.5 mm for GPU VRAM and VRM pads, but you should measure the gap (or consult your GPU/motherboard specifications) to select the right variant. Options range from 0.5 mm up to 3.0 mm to cover virtually all use cases.

Q: Can the GELID GP-Ultimate thermal pad withstand overclocking temperatures?

A: Absolutely. The GP-Ultimate is rated for an extended operating temperature range of -60°C to 220°C, making it well-suited for high-performance builds, overclocked systems, and demanding workstation or gaming PC configurations.

Production & Packaging Notice

To maintain high stock availability and fast shipping times, our items are sourced from multiple verified manufacturing facilities. While the core quality, materials, and product specifications remain identical, you may notice slight variations in the packaging design, manufacturing origin, or the wording of the printed instructions.